The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Jan. 28, 2013
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Kazuhiko Shimodaira, Minowa-machi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 1/00 (2006.01); H01L 41/047 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H01L 41/09 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0475 (2013.01); H01L 41/09 (2013.01); H03H 9/0547 (2013.01); H03H 9/1021 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48091 (2013.01);
Abstract

A piezoelectric device includes an integrated circuit (IC) chip and a piezoelectric resonator element, a part of the piezoelectric resonator element being disposed so as to overlap with a part of the IC chip when viewed in plan. The IC chip includes: an inner pad disposed on an active face and in an area where is overlapped with the piezoelectric resonator when viewed in plan; an insulating layer formed on the active face; a relocation pad disposed on the insulating layer and in an area other than a part where is overlapped with the piezoelectric resonator element, the relocation pad being coupled to an end part of a first wire; and a second wire electrically coupling the inner pad and the relocation pad, the second wire having a relocation wire and a connector that penetrates the insulating layer, the relocation wire being disposed between the insulating layer and the active face.


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