The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Nov. 13, 2013
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Fujitsu Semiconductor Limited, Yokohama-shi, Kanagawa, JP;
Kouichi Kanda, Eindhoven, NL;
Nobumasa Hasegawa, Kawasaki, JP;
FUJITSU LIMITED, Kawasaki, JP;
FUJITSU SEMICONDUCTOR LIMITED, Yokohama, JP;
Abstract
A semiconductor device includes a semiconductor substrate; an active element configured to be formed on the semiconductor substrate; and a multi-layer wiring structure configured to be formed on the semiconductor substrate. A heat dissipation structure is provided in the multi-layer wiring structure. The upper end of the heat dissipation structure forms an external connection pad to be connected with an external wiring board, and the lower end of the heat dissipation structure makes contact with a surface of the semiconductor substrate outside of an element forming region for the active element.