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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9543220 B1

PDFFull Text
Date of Patent:
Jan. 10, 2017

Filed:

Sep. 03, 2014

Substrate processing apparatus, semiconductor device manufacturing method, substrate processing method, and recording medium

Applicant:

Hitachi Kokusai Electric Inc., Tokyo, JP;

Inventor:

Takeo Sato, Toyama, JP;

Assignee:

HITACHI KOKUSAI ELECTRIC INC., Tokyo, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Calvin Choi

Assistant Examiner:

Xiaoming Liu

Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); C23C 16/45551 (2013.01); C23C 16/52 (2013.01); H01L 21/67167 (2013.01); H01L 21/67253 (2013.01); H01L 21/67265 (2013.01); H01L 21/67754 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01); H01L 22/20 (2013.01);
Abstract

According to the present disclosure, it is possible to prevent particles from being generated and to improve substrate processing quality. A substrate processing apparatus includes cassette mounting unit on which process substrate cassette and dummy substrate cassette are mounted, the process substrate cassette being configured to accommodate a plurality of process substrates, and the dummy substrate cassette being configured to accommodate a plurality of dummy substrates, process chamber configured to process the process substrates and the dummy substrates, substrate support unit installed within the process chamber and provided with a plurality of substrate mounting portions where the process substrates and the dummy substrates are mounted, transfer unit configured to transfer the process substrates and the dummy substrates between the cassette mounting unit and the process chamber, and control unit configured to control substrate processing and to transfer processing of the process substrates and the dummy substrates.

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Quick Actions:

Sato, Takeo. (2017). Substrate processing apparatus, semiconductor device manufacturing method, substrate processing method, and recording medium (U.S. Patent No. 9543220). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9543220

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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