The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

May. 31, 2012
Applicants:

Akio Suzuki, Hamamatsu, JP;

Yuto Yanagihara, Hamamatsu, JP;

Hiroshi Kobayashi, Hamamatsu, JP;

Inventors:

Akio Suzuki, Hamamatsu, JP;

Yuto Yanagihara, Hamamatsu, JP;

Hiroshi Kobayashi, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 25/76 (2006.01); H01J 43/04 (2006.01); H01J 43/24 (2006.01); H01J 43/28 (2006.01);
U.S. Cl.
CPC ...
H01J 43/04 (2013.01); H01J 43/246 (2013.01); H01J 43/28 (2013.01);
Abstract

An electron multiplier includes an insulating substrate which includes an electrical wiring pattern and in which a through-hole is formed, an MCP arranged on one side of the through-hole of the insulating substrate and electrically connected to the electrical wiring pattern, a shield plate arranged in one side of the MCP and electrically connected to the MCP, an anode arranged on the other side of the through-hole and electrically connected to the electrical wiring pattern, and a signal readout terminal fixed to the insulating substrate for reading a signal from the anode. The shield plate is formed to include the MCP when viewed in a thickness direction. A through-hole exposing at least a portion of the MCP is formed in the shield plate. The insulating substrate, the MCP, the shield plate and the anode are fixed to each other to be integral.


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