The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Jun. 02, 2015
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor package includes: a plurality of memory packages which are arranged on a substrate; and a logic chip, which has a rhombus shape including first through fourth corners and first through fourth sides connecting the first through fourth corners, is arranged adjacent to the plurality of memory packages, and includes a plurality of terminals that are electrically connected to the plurality of memory packages, as seen on a plan view of the semiconductor package, wherein the plurality of terminals include system address terminals which are adjacent to the first corner of the logic chip and first and second system data terminals which are respectively arranged on the first and second sides contacting the first corner. Another semiconductor package and a method of fabrication are disclosed.