The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Jun. 01, 2015
Applicant:

Textilma Ag, Stansstaad, CH;

Inventor:

Stephan Buehler, Daenikon, CH;

Assignee:

Textilma AG, Stansstaad, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); H01L 23/48 (2006.01); H01L 23/50 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07758 (2013.01); G06K 19/07749 (2013.01); G06K 19/07752 (2013.01); G06K 19/07754 (2013.01); H01L 23/481 (2013.01); H01L 23/49838 (2013.01); H01L 23/50 (2013.01); H01L 23/66 (2013.01); H01L 24/81 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/8112 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/401 (2013.01);
Abstract

A chip module comprises a carrier, having a first main surface and a second main surface opposite to the first main surface. A first recess structure is arranged in the carrier in the first main surface, and a chip is arranged in the first recess structure of the carrier. A patterned metallization layer is deposited on the second main surface of the carrier, the metallization layer having a first metallization structure and a second metallization structure, the first metallization structure being electrically isolated from the second metallization structure. The chip is electrically connected to the first metallization structure and the second metallization structure. The chip module comprises in particular an RFID chip and is suited to be connected to a textile substrate by way of laser reflow soldering.


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