The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Jan. 06, 2014
Applicant:

Honda Motor Co., Ltd., Tokyo, JP;

Inventors:

Satoshi Hasegawa, Tochigi, JP;

Shigeto Akahori, Tochigi, JP;

Shinya Maita, Wako, JP;

Hitoshi Saito, Tochigi, JP;

Yoko Yamaji, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/067 (2006.01); G01R 31/26 (2014.01);
U.S. Cl.
CPC ...
G01R 1/06777 (2013.01); G01R 31/2621 (2013.01); G01R 31/2637 (2013.01);
Abstract

Provided is a current application device capable of applying a test current of a magnitude necessary for testing of a semiconductor element without any trouble. A current application deviceis configured to have a contacting section having a plurality of projectionsfor contacting a contact regioninside an active regionof a semiconductor elementand applying the test current thereto, and a pressing sectionwhich presses the contacting sectionagainst the semiconductor elementsuch that each projectioncontacts the contact region. A plurality of the projectionsare arranged such that an arrangement density of outside projectionsis larger than the arrangement density of inside projections


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