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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9540549 B1

PDFFull Text
Date of Patent:
Jan. 10, 2017

Filed:

Dec. 18, 2012

Anisotropic conductive film and semiconductor device bonded by the same

Applicants:

Kyung IL Sul, Uiwang-si, KR;

Dong Seon Uh, Uiwang-si, KR;

Nam Ju Kim, Uiwang-si, KR;

Kyoung Soo Park, Uiwang-si, KR;

Young Woo Park, Uiwang-si, KR;

Joon MO Seo, Uiwang-si, KR;

Arum Yu, Uiwang-si, KR;

Hyun Min Choi, Uiwang-si, KR;

Inventors:

Kyung Il Sul, Uiwang-si, KR;

Dong Seon Uh, Uiwang-si, KR;

Nam Ju Kim, Uiwang-si, KR;

Kyoung Soo Park, Uiwang-si, KR;

Young Woo Park, Uiwang-si, KR;

Joon Mo Seo, Uiwang-si, KR;

Arum Yu, Uiwang-si, KR;

Hyun Min Choi, Uiwang-si, KR;

Assignee:

CHEIL INDUSTRIES, INC., Gumi-Si, Kyeongsangbuk-Do, KR;

Attorney:

Lee & Morse, P.C.

Primary Examiner:

Mark Kopec

Int. Cl.
CPC ...
H01B 1/20 (2006.01); C09D 5/24 (2006.01); C09J 9/00 (2006.01); H01L 23/00 (2006.01); C09J 163/00 (2006.01); C09J 9/02 (2006.01); H01L 23/29 (2006.01); C08G 59/22 (2006.01); C08G 59/24 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08G 59/226 (2013.01); C08G 59/24 (2013.01); C08G 59/687 (2013.01); C08L 63/00 (2013.01); C09D 5/24 (2013.01); C09J 9/02 (2013.01); H01B 1/20 (2013.01); H01L 23/29 (2013.01); H01L 24/29 (2013.01); C08L 2205/02 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29298 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/15788 (2013.01);
Abstract

A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst.

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