The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Nov. 30, 2015
Kunio Mori, Morioka, JP;
Yusuke Matsuno, Morioka, JP;
Katsuhito Mori, Morioka, JP;
Takahiro Kudo, Morioka, JP;
Kunio Mori, Morioka, JP;
Yusuke Matsuno, Morioka, JP;
Katsuhito Mori, Morioka, JP;
Takahiro Kudo, Morioka, JP;
Other;
Sulfur Chemical Laboratory Incorporated, Morioka-shi, JP;
Abstract
To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (α) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (α) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (α) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.