The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Dec. 08, 2015
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Giuseppe Bruno, Paterno', IT;

Sebastiano Conti, Pregnana Milanese, IT;

Mario Chiricosta, Tremestieri Etneo, IT;

Michele Vaiana, San Giovanni la Punta, IT;

Calogero Marco Ippolito, Aci Castello, IT;

Mario Maiore, Aci Sant'Antonio, IT;

Daniele Casella, Francofonte, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/0292 (2013.01); B81B 2207/094 (2013.01);
Abstract

A packaged sensor assembly includes: a packaging structure, having at least one opening; a humidity sensor and a pressure sensor, which are housed inside the packaging structure and communicate fluidically with the outside through the opening, and a control circuit, operatively coupled to the humidity sensor and to the pressure sensor; wherein the humidity sensor and the control circuit are integrated in a first chip, and the pressure sensor is integrated in a second chip distinct from the first chip and bonded to the first chip.


Find Patent Forward Citations

Loading…