The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Oct. 01, 2012
Applicant:

Mitsui High-tec, Inc., Kitakyushu-shi, Fukuoka, JP;

Inventors:

Yukinori Oba, Kitakyushu, JP;

Hirokazu Arakawa, Kitakyushu, JP;

Assignee:

MITSUI HIGH-TEC, INC., Kitakyushu-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/04 (2006.01); H02K 15/02 (2006.01); B21D 28/02 (2006.01); B21D 28/06 (2006.01);
U.S. Cl.
CPC ...
B32B 38/04 (2013.01); H02K 15/02 (2013.01); B21D 28/02 (2013.01); B21D 28/06 (2013.01); B32B 2038/042 (2013.01); H02K 15/022 (2013.01); H02K 15/024 (2013.01); Y10T 156/1056 (2015.01); Y10T 156/1062 (2015.01); Y10T 156/1075 (2015.01); Y10T 156/12 (2015.01); Y10T 156/13 (2015.01);
Abstract

A laminated core manufacturing method for performing rotational lamination by conveying a band-shaped material to be stampedto a die apparatus to successively perform presswork, stamping out and dropping manufactured core piecesinto a blanking dieand rotating the blanking dieby a predetermined angle, in which a positioning mechanism for the blanking die, which has rotational lamination guide pins and rotational lamination guide holes-, is disposed inward from both ends in a width direction of the band-shaped material to be stampedand temporary holes-for the rotational lamination guide pins to be inserted are provided in the band-shaped material to be stamped. The structure allows downsizing of the die apparatus.


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