The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Jul. 24, 2013
Applicants:
Dmg Mori Seiki Co., Ltd., Nara, JP;
Fuji Jukogyo Kabushiki Kaisha, Tokyo, JP;
Inventors:
Morihiro Hideta, Nara, JP;
Koji Sato, Nara, JP;
Hisayuki Oide, Tokyo, JP;
Shinya Matsuo, Tokyo, JP;
Tatsuo Nakahata, Tokyo, JP;
Assignees:
DMG MORI SEIKI CO., LTD., Yamatokoriyama-shi, Nara, JP;
FUJI JUKOGYO KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23Q 11/00 (2006.01);
U.S. Cl.
CPC ...
B23Q 11/0046 (2013.01); B23Q 2220/008 (2013.01); Y02P 70/171 (2015.11);
Abstract
A connection portion between a holder side part of a chip suction path and a main body side part of the chip suction pathis formed to have a non-contact structure, resulting in that not only a chip generated at a machining point but also a chip remained so as to be suspended in a machining atmosphere can be sucked and discharged.