The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Sep. 06, 2010
Edward Willem Albert Young, Maastricht, NL;
Erik Dekempeneer, Malle, BE;
Antonius Maria Bernardus Van Mol, Eindhoven, NL;
Herbert Lifka, Son en Breugel, NL;
Peter Van DE Weijer, Heeze, NL;
Bernhard Sailer, Ranspach-le-Haut, FR;
Emilie Galand, Saint Louis la Chaussee, FR;
Richard Frantz, Village Neuf, FR;
Dimiter Lubomirov Kotzev, Basel, CH;
Mohammed Zoubair Cherkaoui, Allschwil, CH;
Edward Willem Albert Young, Maastricht, NL;
Erik Dekempeneer, Malle, BE;
Antonius Maria Bernardus van Mol, Eindhoven, NL;
Herbert Lifka, Son en Breugel, NL;
Peter van de Weijer, Heeze, NL;
Bernhard Sailer, Ranspach-le-Haut, FR;
Emilie Galand, Saint Louis la Chaussee, FR;
Richard Frantz, Village Neuf, FR;
Dimiter Lubomirov Kotzev, Basel, CH;
Mohammed Zoubair Cherkaoui, Allschwil, CH;
Abstract
An apparatus is described for coating a flexible substrate with at least a first organic layer and a first inorganic layer. The apparatus comprises a first and a second chamber and an atmosphere decoupling slot between the first and the second chamber. A printing facility is arranged in the first chamber, for printing the flexible substrate with a mixture comprising at least one precursor for a polymer, oligomer or a polymer network and a polymerization initiator. A curing facility is arranged in the first chamber, for curing the deposited mixture, therewith forming the at least first organic layer. A vapor deposition facility is arranged in the second chamber, for depositing the at least first inorganic layer at the substrate provided with the at least first organic layer. The apparatus comprises a facility for guiding the flexible substrate along the printing facility, along the curing facility and via the atmosphere decoupling slot along the vapor deposition facility.