The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Sep. 16, 2014
Applicant:

Neumodx Molecular, Inc., Ann Arbor, MI (US);

Inventors:

Sundaresh Brahmasandra, Ann Arbor, MI (US);

Thomas Haddock, Ann Arbor, MI (US);

Patrick Duffy, Whitmore Lake, MI (US);

Jeffrey Williams, Chelsea, MI (US);

Assignee:

NeuMoDx Molecular, Inc., Ann Arbor, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B01L 1/00 (2006.01); B01L 3/00 (2006.01); B01L 7/00 (2006.01);
U.S. Cl.
CPC ...
B01L 7/52 (2013.01); B01L 2200/12 (2013.01); B01L 2200/147 (2013.01); B01L 2300/0819 (2013.01); B01L 2300/168 (2013.01); B01L 2300/1827 (2013.01); Y10T 29/49083 (2015.01);
Abstract

A system for thermocycling biological samples within detection chambers comprising: a set of heater-sensor dies, each heater-sensor die comprising a heating surface configured to interface with a detection chamber and a second surface, inferior to the heating surface, including a first connection point; an electronics substrate, comprising a first substrate surface coupled to the second surface of each heater-sensor die, an aperture providing access through the electronics substrate to at least one heater-sensor die, and a second substrate surface inferior to the first substrate surface, wherein the electronics substrate comprises a set of substrate connection points at least at one of the first substrate surface, an aperture surface defined within the aperture, and the second substrate surface, and wherein the electronics substrate is configured to couple heating elements and sensing elements of the set of heater-sensor dies to a controller; and a set of wire bonds, including a wire bond coupled between the first connection point of at least one of the set of heater-sensor dies and one of the set of substrate connection points.


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