The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Apr. 11, 2012
Applicants:

Robert Luciano, Jr., Reno, NV (US);

Warren White, Reno, NV (US);

David Grieshaber, Brisbane, CA (US);

Inventors:

Robert Luciano, Jr., Reno, NV (US);

Warren White, Reno, NV (US);

David Grieshaber, Brisbane, CA (US);

Assignee:

EDGE TECHNOLOGY, Reno, NV (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G08B 13/14 (2006.01); A63B 43/00 (2006.01); A63B 37/00 (2006.01); B29C 43/18 (2006.01); B29C 43/02 (2006.01); A63B 24/00 (2006.01);
U.S. Cl.
CPC ...
A63B 43/00 (2013.01); A63B 37/0003 (2013.01); B29C 43/027 (2013.01); B29C 43/18 (2013.01); A63B 2024/0037 (2013.01); A63B 2220/10 (2013.01); A63B 2225/15 (2013.01); A63B 2225/54 (2013.01);
Abstract

A spherical compressible ball having an RFID tag is described. The ball comprises an RFID integrated circuit, an encapsulating material, a first antenna contact, a first conductive wire, a molded compressible core, and a molded shell. The RFID integrated circuit includes a memory that stores a unique identifier. The encapsulating material encapsulates the RFID integrated circuit. The first antenna contact is electrically coupled to the encapsulated RFID integrated circuit. The first conductive wire is electrically coupled to the first antenna contact. The molded compressible core includes a molded impression that receives the encapsulated RFID integrated circuit and the conductive wire. The molded shell further encapsulates the molded compressible core that receives the encapsulated RFID integrated circuit and antenna.


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