The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Jun. 24, 2015
Applicant:

Samsung Medison Co., Ltd., Hongcheon-gun, Gangwon-do, KR;

Inventors:

Jin Woo Jung, Seoul, KR;

Jeong Cheol Seo, Gwangju-si, KR;

Jae Yk Kim, Seoul, KR;

Assignee:

SAMSUNG MEDISON CO., LTD., Hongcheon-gun, Gangwon-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/14 (2006.01); A61B 8/00 (2006.01); B06B 1/06 (2006.01); G10K 11/00 (2006.01);
U.S. Cl.
CPC ...
A61B 8/4444 (2013.01); A61B 8/4494 (2013.01); B06B 1/0622 (2013.01); G10K 11/004 (2013.01); Y10T 29/43 (2015.01); Y10T 29/49005 (2015.01);
Abstract

A probe for an ultrasonic diagnostic apparatus includes including backing members, a first connector bonded between the backing members and including electrodes spaced from each other in an arrangement direction, a ground connector bonded between the backing members to be spaced from the first connector, and a piezoelectric member electrically connected to the electrodes and the ground connector. A method of manufacturing the same is also disclosed. The piezoelectric member is joined to the first connector and the ground connector or to first and second connectors and the ground connector via first and second electrode layers instead of using a complicated and laborious soldering operation, thereby enabling easy connection between the piezoelectric member and the connectors while preventing deterioration in performance caused by defective connection therebetween and deterioration in performance of the piezoelectric member caused by heat during manufacture.


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