The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Jul. 30, 2014
Applicants:
Fu Tai Hua Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Inventors:
Assignees:
Fu Tai Hua Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 5/02 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0213 (2013.01); G06F 1/20 (2013.01); H05K 7/20409 (2013.01);
Abstract
An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device.