The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Mar. 06, 2014
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Nobuaki Ogawa, Kyoto-fu, JP;

Yoshihito Otsubo, Kyoto-fu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 1/11 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2006.01); H05K 3/46 (2006.01); H01L 23/538 (2006.01); H05K 3/40 (2006.01); H05K 3/28 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H01L 21/4853 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 25/0652 (2013.01); H05K 3/303 (2013.01); H05K 3/4015 (2013.01); H05K 3/4046 (2013.01); H05K 3/4644 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1531 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/1031 (2013.01); H05K 2201/10242 (2013.01); H05K 2201/10515 (2013.01); H05K 2203/1316 (2013.01); Y02P 70/611 (2015.11); Y10T 29/49146 (2015.01);
Abstract

When forming a modulehaving a configuration in which a column-shaped connection terminal, which forms an interlayer connection conductor, and an electronic componentare mounted on a wiring substrateand sealed with a resin, the column-shaped connection terminalwhich has a substantially T-shaped cross section and in which a first end portion has a larger diameter than a second end portion is prepared (the preparation step), an electronic componentis mounted on one main surface of the wiring substrateand the connection terminalis mounted on the one main surface in such a manner that the second end portion of the connection terminalhaving a smaller diameter is connected to the wiring substrate(the mounting step), and the electronic componentand the connection terminalare sealed with a resin layer(the sealing step).


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