The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Apr. 23, 2014
Applicant:

Kuraray Co., Ltd., Kurashiki-shi, JP;

Inventors:

Minoru Onodera, Saijo, JP;

Tatsuya Sunamoto, Saijo, JP;

Shuji Matsunaga, Saijo, JP;

Takafumi Konno, Saijo, JP;

Assignee:

KURARAY CO., LTD., Kurashiki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/46 (2006.01); C08J 5/18 (2006.01); B32B 37/06 (2006.01); C09K 19/38 (2006.01); B32B 15/09 (2006.01); B32B 37/18 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 37/10 (2006.01); H05K 1/02 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0313 (2013.01); B32B 15/08 (2013.01); B32B 15/09 (2013.01); B32B 15/20 (2013.01); B32B 27/20 (2013.01); B32B 27/286 (2013.01); B32B 27/32 (2013.01); B32B 27/322 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 37/06 (2013.01); B32B 37/182 (2013.01); C08J 5/18 (2013.01); C09K 19/3809 (2013.01); H05K 1/032 (2013.01); H05K 1/0326 (2013.01); H05K 3/4626 (2013.01); B32B 37/10 (2013.01); B32B 2250/42 (2013.01); B32B 2305/55 (2013.01); B32B 2307/202 (2013.01); B32B 2309/02 (2013.01); B32B 2309/105 (2013.01); B32B 2457/00 (2013.01); C08J 2300/12 (2013.01); C08J 2367/03 (2013.01); H05K 1/024 (2013.01); H05K 3/022 (2013.01); H05K 2201/0141 (2013.01); H05K 2203/068 (2013.01); Y10T 428/31678 (2015.04);
Abstract

To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (∈) of the film after heating to a dielectric constant (∈) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30° C. lower than a melting point of the film to a temperature being 10° C. higher than the melting point,|∈−∈|/∈×100≦5  (I)


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