The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

May. 27, 2014
Applicant:

Epcos Ag, Munich, DE;

Inventors:

Hisashi Kobuke, Tokyo, JP;

Yousuke Futamata, Tokyo, JP;

Emi Ninomiya, Tokyo, JP;

Assignee:

EPCOS AG, Munich, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/03 (2006.01); H05K 1/00 (2006.01); H05K 3/46 (2006.01); C03C 12/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); C03C 12/00 (2013.01); H05K 1/0298 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/4629 (2013.01); H05K 3/4617 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0266 (2013.01);
Abstract

A multilayer wiring substrate includes a number of insulating layers, each insulating layer including a glass ceramic. A number of internal conductor layers are formed between the insulating layers. Via conductors penetrate through the insulating layers and mutually connect the internal conductor layers in different layer locations. Surface conductor layers are formed on an outer surfaces in a lamination direction of the insulating layers. The insulating layers include outside insulating layers and inside insulating layers. A first aspect ratio representing an oblateness and sphericity of an external filler contained in the outside insulating layers is larger than a second aspect ratio representing an oblateness and sphericity of an internal filler contained in the inside insulating layers. A thermal expansion coefficient of the outside insulating layers is smaller than a thermal expansion coefficient of the inside insulating layers.


Find Patent Forward Citations

Loading…