The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Dec. 03, 2014
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Darryl Jessie, San Diego, CA (US);
Lan Nan, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/00 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01P 3/006 (2013.01); H01L 21/768 (2013.01); H01L 23/528 (2013.01); H01L 23/66 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01P 3/003 (2013.01); H01L 2223/6605 (2013.01); H01L 2223/6627 (2013.01);
Abstract
In an integrated circuit package that houses radio-frequency (RF) circuits or components using wafer-level packaging (WLP), an RF-signal transmission structure includes a signal-carrying conductive line positioned between grounded conductive lines to avoid undesirable coupling between the signal-carrying conductive line and other RF circuits or components in the same package.