The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Sep. 13, 2005
Applicants:

Ewald Karl Michael Guenther, Regenstauf, DE;

Jörg Erich Sorg, Regensburg, DE;

Norbert Stath, Regensburg, DE;

Inventors:

Ewald Karl Michael Guenther, Regenstauf, DE;

Jörg Erich Sorg, Regensburg, DE;

Norbert Stath, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 33/52 (2010.01); H01L 33/54 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/508 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/24998 (2013.01); H01L 2224/82007 (2013.01); H01L 2224/82039 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/351 (2013.01);
Abstract

An optoelectronic component contains a semiconductor chip () and a carrier body (), which are provided with a transparent, electrically insulating encapsulation layer (), the encapsulation layer () having two cutouts () for uncovering a contact area () and a connection region () of the carrier body, and an electrically conductive layer () being led from the contact area () over a partial region of the encapsulation layer () to the electrical connection region () of the carrier body () in order to electrically connect the contact area () and the electrical connection region () to one another. The radiation emitted in a main radiation direction () by the semiconductor chip () is coupled out through the encapsulation layer (), which advantageously contains luminescence conversion substances for the wavelength conversion of the emitted radiation.


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