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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9537055 B1

PDFFull Text
Expired
Date of Patent:
Jan. 03, 2017

Filed:

Sep. 18, 2014

Semiconductor light emitting diode package and lighting device using the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Myoung Bo Park, Suwon-Si, KR;

Kyung Seok Oh, Seongnam-si, KR;

Ho Young Song, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:

Lee & Morse, P.C.

Primary Examiner:

Donald Raleigh

Assistant Examiner:

Kevin Quarterman

Int. Cl.
CPC ...
H01L 33/38 (2010.01); H01L 33/62 (2010.01); H01L 33/40 (2010.01); H01L 33/42 (2010.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/38 (2013.01); H01L 33/62 (2013.01); H01L 33/405 (2013.01); H01L 33/42 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49107 (2013.01);
Abstract

A semiconductor LED package includes a package body having first and second electrode structures and an LED chip connected to at least one of the first and second electrode structures using a wire. The LED chip includes a light emitting structure and first and second electrode parts. At least one of the first and second electrode parts includes a bonding electrode layer made of a material having the same composition as a material of the wire and bonded to the wire, and an uneven electrode layer disposed on the bonding electrode layer and having at least one through hole filled with the wire. The at least one through hole allows a top surface of the bonding electrode layer to be exposed therebelow.

Find Patent Forward Citations

Park, Myoung. (2017). Semiconductor light emitting diode package and lighting device using the same (U.S. Patent No. 9537055). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9537055

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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