The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Oct. 23, 2013
Applicants:

Aledia, Grenoble, FR;

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Philippe Gilet, Teche, FR;

Xavier Hugon, Teche, FR;

David Vaufrey, Grenoble, FR;

Hubert Bono, Grenoble, FR;

Bérangère Hyot, Eybens, FR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 31/18 (2006.01); B82Y 40/00 (2011.01); H01L 33/18 (2010.01); H01L 33/08 (2010.01); H01L 33/24 (2010.01); B82Y 20/00 (2011.01);
U.S. Cl.
CPC ...
H01L 33/007 (2013.01); B82Y 40/00 (2013.01); H01L 31/1804 (2013.01); H01L 31/1852 (2013.01); H01L 33/0054 (2013.01); H01L 33/18 (2013.01); B82Y 20/00 (2013.01); H01L 33/08 (2013.01); H01L 33/24 (2013.01);
Abstract

A method for manufacturing an optoelectric device comprising a semiconductor substrate, pads on a surface of the substrate; semiconductor elements, each element being in contact with a pad; and a dielectric region extending in the substrate from the surface and connecting, for each pair of pads, one of the pads in the pair to the other pad in the pair, the method successively comprising the forming of the pads and the forming of the region, wherein the region is formed by nitriding of the substrate, the method comprising the successive steps of: depositing a layer on the substrate; forming portions on the layer; etching the parts of the layer which are not covered with the portions to form the pads; removing the portions; and nitriding the pads and the parts of the substrate which are not covered with the pads, wherein the nitriding step successively comprises: a first step of nitriding of the pads at a first temperature; and a second step of nitriding of the parts of the substrate which are not covered with the pads at a second temperature different from the first temperature.


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