The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Jul. 14, 2016
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Hidehiko Kira, Nagano, JP;

Takumi Masuyama, Kawasaki, JP;

Norio Kainuma, Nagano, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 21/56 (2013.01); H01L 24/81 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81805 (2013.01);
Abstract

A heating header of a semiconductor mounting apparatus includes: a first material; and a second material, the second material being bonded to the first material and coming into contact with a first semiconductor chip when the first semiconductor chip is compressed, wherein a contact surface of the second material with the first semiconductor chip is a curved surface that is convex toward the first semiconductor chip side, and the contact surface of the second material with the first semiconductor chip becomes a planar surface when each temperature of the first material and the second material reaches a melting temperature of a solder that is formed between a first terminal of the first semiconductor chip and a second terminal of a second semiconductor chip.


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