The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Oct. 01, 2014
Applicant:

Intersil Americas Llc, Milpitas, CA (US);

Inventors:

Randolph Cruz, Melbourne, FL (US);

Loyde Milton Carpenter, Jr., Palm Bay, FL (US);

Assignee:

Intersil Americas LLC, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 21/4828 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 23/49513 (2013.01); H01L 23/49586 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/84 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29007 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/92246 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1425 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01);
Abstract

Embodiments described herein relate to a packaged circuit including a lead frame having at least one recess pattern on an internal surface thereof. The at least one recess pattern includes a perimeter recess that defines a perimeter around one or more raised surfaces. The packaged circuit also includes a component having one or more terminals. One of the terminals is mounted to the one or more raised surfaces such that the terminal covers the perimeter recess, wherein the perimeter recess has a size and shape such that the recess is proximate a perimeter of the terminal. The packaged circuit also includes component attach adhesive between the single terminal of the component and the one or more raised surfaces of the lead frame.


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