The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Sep. 05, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Friedrich Kroener, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/14 (2006.01); H01L 23/00 (2006.01); B23K 35/02 (2006.01); B23K 1/00 (2006.01); B23K 35/30 (2006.01); B23K 35/32 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B23K 1/0016 (2013.01); B23K 35/0233 (2013.01); B23K 35/0238 (2013.01); B23K 35/0244 (2013.01); B23K 35/302 (2013.01); B23K 35/32 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); B23K 2201/40 (2013.01); H01L 24/06 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05747 (2013.01); H01L 2224/05893 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/271 (2013.01); H01L 2224/276 (2013.01); H01L 2224/2711 (2013.01); H01L 2224/2712 (2013.01); H01L 2224/2746 (2013.01); H01L 2224/27442 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29157 (2013.01); H01L 2224/29193 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29271 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29447 (2013.01); H01L 2224/29471 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/831 (2013.01); H01L 2224/8382 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83693 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/20641 (2013.01); H01L 2924/20642 (2013.01); H01L 2924/20643 (2013.01); H01L 2924/20644 (2013.01);
Abstract
A preform structure for soldering a semiconductor chip arrangement includes a carbon fiber composite sheet and a solder layer formed over the carbon fiber composite sheet.