The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Aug. 13, 2014
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventor:

Kazutaka Takagi, Kawasaki, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 1/02 (2006.01); H01L 23/66 (2006.01); H01P 5/107 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01P 5/107 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/16153 (2013.01);
Abstract

According to one embodiment, a semiconductor package includes: a first metal body on which a part of a waveguide structure is formed; a second metal body including a mounting area for a semiconductor device and disposed on the first metal body; a line substrate on which a signal transmission line configured to communicate a waveguide with the semiconductor device mounted on the mounting area is formed; and a lid body disposed at a position facing the first metal body, interposing the second metal body and the line substrate. The lid body is made of resin, on which a structure corresponding to another waveguide structure on an extension of the waveguide structure in the first metal body is formed. The structure includes a metal-coated inner wall surface.


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