The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Dec. 21, 2012
Applicant:
Commissariat a L'energie Atomique ET Aux Ene Alt, Grenoble, FR;
Inventor:
Yann Lamy, Grenoble, FR;
Assignee:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/486 (2013.01); H01L 23/481 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/13022 (2013.01); H01L 2924/00014 (2013.01);
Abstract
A TSV via structure comprising an upper part made on the side of the front face of a substrate in which electronic components are located and a lower part with height and cross-section smaller than the height and cross-section the upper part, the arrangement of the connection element in the substrate being such that it releases stresses generated by the different materials of said structure.