The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Dec. 19, 2012
Applicant:

Renesas Electronics Corporation, Kawasaki, JP;

Inventors:

Shinichi Uchida, Kawasaki, JP;

Hirokazu Nagase, Kawasaki, JP;

Takuo Funaya, Kawasaki, JP;

Assignee:

Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/522 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2006.01); H01L 27/06 (2006.01); H01L 23/495 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 23/49575 (2013.01); H01L 23/528 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 24/06 (2013.01); H01L 24/49 (2013.01); H01L 25/0655 (2013.01); H01L 27/0688 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3011 (2013.01);
Abstract

On a semiconductor substrate, coils CLand CLand pads PD, PD, and PDare formed. The coil CLand the coil CLare electrically connected in series between the pad PDand the pad PD, and the pad PDis electrically connected between the coil CLand the coil CL. The coil magnetically coupled to the coil CLis formed just below the coil CL, the coil magnetically coupled to the coil CLis formed just below the coil CL, and they are connected in series. When a current is flowed in the coils connected in series formed just below the coils CLand CL, directions of induction current flowing in the coils CLand CLare opposed to each other in the coils CLand CL


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