The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Nov. 06, 2014
Applicant:

Origin Gps Ltd., Airport City, IL;

Inventor:

Haim Goldberger, Modi'in, IL;

Assignee:

ORIGIN GPS LTD., Airport City, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/20 (2006.01); H01L 23/522 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/4814 (2013.01); H01L 21/50 (2013.01); H01L 21/768 (2013.01); H01L 23/5385 (2013.01); H01L 25/0652 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method of forming an integrated circuit, including providing a first substrate layer having a center piece and two side pieces on opposite sides of the center piece, assembling one or more circuit elements on a top side and a bottom side of the center piece of the first substrate layer, preparing two support pieces from a substrate, matching the size of the side pieces, coupling the support pieces to the bottom of the first substrate layer under the side pieces to form a second substrate layer with a void in the center under the center piece of the first substrate layer; and wherein the side pieces and support pieces include via connectors electrically connecting between a bottom side of the second substrate layer and the circuit elements.


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