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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9536817 B1

PDFFull Text
Date of Patent:
Jan. 03, 2017

Filed:

Dec. 22, 2015

Electronic devices and methods of manufacturing electronic devices

Applicant:

Hana Micron Inc., Asan-si, KR;

Inventors:

Jae-Sung Lim, Suwon-si, KR;

Hyung-Jun Kim, Yangju-si, KR;

Assignee:

HANA MICRON INC., Asan-si, KR;

Attorney:

Daly, Crowley, Mofford & Durkee, LLP

Primary Examiner:

Douglas Menz

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); H01L 21/565 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/293 (2013.01); H01L 23/3135 (2013.01); H01L 23/36 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/181 (2013.01);
Abstract

Disclosed are a foldable and spreadable electronic device and a method of manufacturing the electronic device. The electronic device may include a flexible chip, a protection film and a flexible substrate. The flexible chip may include a first wiring on a first face thereof. The flexible chip may have a foldable and spreadable structure by reducing a thickness from a second face thereof. The protection film may be disposed on the second face of the flexible chip for protecting the flexible chip. The flexible substrate may include a second wiring on one face thereof. The protection film on disposed on the second face of the flexible chip may make contact with the flexible substrate. The first wiring of the flexible chip may be electrically connected to the second wiring of the flexible substrate using a wire.

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