The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Jun. 27, 2014
Dexerials Corporation, Shinagawa-ku, Tokyo, JP;
Keisuke Aramaki, Utsunomiya, JP;
Atsuya Yoshinari, Kanuma, JP;
Takuhiro Ishii, Tachikawa, JP;
Shinichi Uchida, Utsunomiya, JP;
Masahiko Ito, Nikko, JP;
Dexerials Corporation, Shinagawa-ku, Tokyo, JP;
Abstract
Provided is a method of manufacturing a heat conductive sheet that itself is imparted with stickiness and has reduced heat resistance due to improved adhesion to a heat generator and a heat dissipater and that may be fixed provisionally without the need for using an adhesive agent or the like. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and coating an entire surface of a sheet main body () with an uncured component () of the binder resin oozing from the sheet main body ().