The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Sep. 08, 2015
Applicant:

Rf Micro Devices, Inc., Greensboro, NC (US);

Inventors:

David Charles Sheridan, Greensboro, NC (US);

Robert Charles Dry, Oak Ridge, NC (US);

Don Willis, Kernersville, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 25/07 (2006.01); H05K 7/20 (2006.01); H01L 27/095 (2006.01); H01L 27/088 (2006.01); H01L 29/10 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 23/345 (2013.01); H01L 23/3677 (2013.01); H01L 23/3736 (2013.01); H01L 23/49844 (2013.01); H01L 25/072 (2013.01); H01L 27/088 (2013.01); H01L 27/095 (2013.01); H01L 29/1079 (2013.01); H05K 7/205 (2013.01); H05K 7/20963 (2013.01); H01L 23/49827 (2013.01); H01L 29/4232 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01);
Abstract

An integrated power module having a depletion mode device and an enhancement mode device that is configured to prevent an accidental on-state condition for the depletion mode device during a gate signal loss is disclosed. In particular, the disclosed integrated power module is structured to provide improved isolation and thermal conductivity. The structure includes a substrate having a bottom drain pad for the depletion mode device disposed on the substrate and an enhancement mode device footprint-sized cavity that extends through the substrate to the bottom drain pad. A thermally conductive and electrically insulating slug substantially fills the cavity to provide a higher efficient thermal path between the enhancement mode device and the bottom drain pad for the depletion mode device.


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