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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9536799 B1

PDFFull Text
Date of Patent:
Jan. 03, 2017

Filed:

Dec. 20, 2013

Hot-melt type curable silicone composition for compression molding or laminating

Applicants:

Dow Corning Corporation, Midland, MI (US);

Dow Corning Toray Co., Ltd., Tokyo, JP;

Inventors:

Shin Yoshida, Chiba, JP;

Makoto Yoshitake, Chiba, JP;

Haruna Yamazaki, Chiba, JP;

Masaaki Amako, Chiba, JP;

Steven Swier, Midland, MI (US);

Toshiki Nakata, Chiba, JP;

Assignees:

Dow Corning Corporation, Midland, MI (US);

Dow Corning Toray Co., Ltd., Tokyo, JP;

Attorney:

Schwegman Lundberg & Woessner, P.A.

Primary Examiner:

Marc Zimmer

Int. Cl.
CPC ...
H01L 23/29 (2006.01); B32B 9/04 (2006.01); H01L 21/56 (2006.01); C08K 3/34 (2006.01); C08K 3/36 (2006.01); C08K 3/22 (2006.01); B32B 27/28 (2006.01); B32B 27/08 (2006.01); B32B 7/02 (2006.01); C09D 183/10 (2006.01); C08G 77/50 (2006.01); C09J 183/10 (2006.01); H01L 33/56 (2010.01); B32B 3/30 (2006.01); H01L 33/50 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/296 (2013.01); B32B 7/02 (2013.01); B32B 27/08 (2013.01); B32B 27/283 (2013.01); C08G 77/50 (2013.01); C08K 3/22 (2013.01); C08K 3/34 (2013.01); C08K 3/36 (2013.01); C09D 183/10 (2013.01); C09J 183/10 (2013.01); H01L 21/56 (2013.01); H01L 33/56 (2013.01); B32B 3/30 (2013.01); B32B 2250/24 (2013.01); B32B 2264/104 (2013.01); B32B 2307/418 (2013.01); B32B 2307/536 (2013.01); B32B 2457/14 (2013.01); C08K 2003/2241 (2013.01); C08K 2201/00 (2013.01); H01L 24/73 (2013.01); H01L 24/97 (2013.01); H01L 33/502 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01); Y10T 428/24612 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/24983 (2015.01); Y10T 428/31663 (2015.04);
Abstract

The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.

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