The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Sep. 18, 2013
Applicants:

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Sumitomo Electric Fine Polymer, Inc., Sennan-gun, Osaka, JP;

Inventors:

Satoshi Yamasaki, Osaka, JP;

Shinya Nishikawa, Osaka, JP;

Ryouhei Fujita, Sennan-gun, JP;

Yasutaka Emoto, Sennan-gun, JP;

Assignees:

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;

SUMITOMO ELECTRIC FINE POLYMER, INC., Sennan-gun, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02G 15/08 (2006.01); H02G 3/04 (2006.01); B32B 7/12 (2006.01); H01B 3/44 (2006.01); H02G 15/18 (2006.01); B32B 27/18 (2006.01); H01B 7/00 (2006.01); H01B 3/30 (2006.01); B32B 27/08 (2006.01); B32B 27/22 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 1/08 (2006.01);
U.S. Cl.
CPC ...
H01B 3/448 (2013.01); B32B 1/08 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/22 (2013.01); B32B 27/304 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); H01B 3/305 (2013.01); H01B 3/441 (2013.01); H01B 7/0045 (2013.01); H02G 15/1806 (2013.01); B32B 2250/02 (2013.01); B32B 2307/206 (2013.01); B32B 2307/51 (2013.01); B32B 2307/542 (2013.01); B32B 2307/736 (2013.01); B32B 2457/00 (2013.01); H02G 3/0481 (2013.01); Y10T 428/2852 (2015.01);
Abstract

A multilayered heat-recoverable articleincludes a base material layerand an adhesive layerdisposed on the inner side of the base material layer. The adhesive layerincludes [A] a thermoplastic resin having a melt flow rate of 15 g/10 min to 1,000 g/10 min at 190° C. and a load of 2.16 kg, [B] an organically treated layered silicate, and [C] a deterioration inhibitor. The shear viscosity at 150° C. of the adhesive layeris 300 Pa·s or more at a shear rate of 0.1 sand 200 Pa·s or less at a shear rate of 100s.


Find Patent Forward Citations

Loading…