The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9535390 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 03, 2017

Filed:

Dec. 28, 2015
Applicant:

Kyocera Document Solutions Inc., Osaka, JP;

Inventor:

Akinori Matsuno, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03G 15/00 (2006.01); G03G 21/16 (2006.01); G03G 21/20 (2006.01);
U.S. Cl.
CPC ...
G03G 15/80 (2013.01); G03G 15/6552 (2013.01); G03G 21/1619 (2013.01); G03G 21/1652 (2013.01); G03G 21/206 (2013.01); G03G 2221/1645 (2013.01);
Abstract

An image forming apparatus includes an apparatus main body, a paper sheet feeder, an image forming circuit, a paper sheet discharge unit, and a high voltage circuit board. The paper sheet feeder is located in the apparatus main body to feed a sheet. The image forming circuit is located in the apparatus main body to form an image on the sheet fed by the paper sheet feeder. The image formed sheet with is discharged to the paper sheet discharge unit. The high voltage circuit board is located along a horizontal direction over the image forming circuit in the apparatus main body to supply a high voltage to the image forming circuit.


Find Patent Forward Citations

Matsuno, Akinori. (2017). Image forming apparatus that prevents occurrence of failure in association with temperature rise of circuit board (U.S. Patent No. 9535390). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9535390

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