The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Jun. 17, 2015
Applicant:
Femtotools Ag, Buchs, CH;
Inventors:
Felix Beyeler, Regensdorf, CH;
Simon Muntwyler, Zurich, CH;
Assignee:
FemtoTools AG, Buchs, CH;
Primary Examiner:
Int. Cl.
CPC ...
G01Q 20/00 (2010.01); B81C 99/00 (2010.01); G01Q 20/04 (2010.01); G01Q 60/36 (2010.01); G01N 3/42 (2006.01); G01L 1/14 (2006.01); G01L 5/00 (2006.01); G01Q 10/04 (2010.01);
U.S. Cl.
CPC ...
G01Q 20/00 (2013.01); B81C 99/005 (2013.01); G01L 1/148 (2013.01); G01L 5/0038 (2013.01); G01N 3/42 (2013.01); G01Q 10/045 (2013.01); G01Q 20/04 (2013.01); G01Q 60/366 (2013.01); G01N 2203/0286 (2013.01);
Abstract
A micro fabricated sensor for micro-mechanical and nano-mechanical testing and nano-indentation. The sensor includes a force sensing capacitive comb drive for the sensing of a force applied to a sample, a position sensing capacitive comb drive for the sensing of the position of a sample and a micro fabricated actuator to apply a load to the sample. All the sensor components mentioned above are monolithically integrated on the same silicon MEMS chip.