The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Oct. 03, 2014
Applicants:
Huga Optotech Inc., Taichung, TW;
Interlight Optotech Corporation, Yangmei, Taoyuan County, TW;
Inventor:
Tzu-Chi Cheng, Yangmei, TW;
Assignees:
Huga Optotech Inc., Taichung, TW;
Interlight Optotech Corporation, Yangmei, Taoyuan County, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21K 9/90 (2016.01); F21K 99/00 (2016.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
F21K 9/90 (2013.01); H01L 24/97 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/48249 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0033 (2013.01);
Abstract
Disclosed embodiments include a manufacturing method for an LED assembly. Providing a first carrier, wherein several LED chips are formed on the first carrier, and providing a second carrier. Attaching the second carrier to the LED chips and detaching the first carrier from the LED chips but leaving the LED chips on the second carrier.