The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Dec. 11, 2014
Applicant:

Analog Devices, Inc., Norwood, MA (US);

Inventors:

Thomas M. Goida, Windham, NH (US);

Kathleen O'Donnell, Arlington, MA (US);

Michael Delaus, Andover, MA (US);

Assignee:

ANALOG DEVICES, INC., Norwood, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 25/18 (2006.01); H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01L 23/34 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0074 (2013.01); B81C 1/00301 (2013.01); H01L 23/13 (2013.01); H01L 23/34 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 24/14 (2013.01); H01L 25/18 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/83851 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Various low stress compact device packages are disclosed herein. An integrated device package can include a first integrated device die and a second integrated device die. An interposer can be disposed between the first integrated device die and the second integrated device die such that the first integrated device die is mounted to and electrically coupled to a first side of the interposer and the second integrated device die is mounted to and electrically coupled to a second side of the interposer. The first side can be opposite the second side. The interposer can comprise a hole through at least the second side of the interposer. A portion of the second integrated device die can extend into the hole.


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