The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Feb. 19, 2016
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Steve Canale, Simi Valley, CA (US);

David J. Zapp;

Daniel Eduardo Sanchez, Camarillo, CA (US);

Hung V. Phan, Simi Valley, CA (US);

Hyong Yong Lee, Thousand Oaks, CA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); B32B 43/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); H01L 21/67005 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01); H01L 21/6835 (2013.01); H01L 21/6838 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1933 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1961 (2015.01); Y10T 156/1978 (2015.01);
Abstract

A first surface of a debonder defines a recess to hold an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The carrier plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the carrier plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface, where the second surface includes suction openings that deliver a suction force to the recess, and a portion of the second surface is in contact with a heat source.


Find Patent Forward Citations

Loading…