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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9533473 B1

PDFFull Text
Date of Patent:
Jan. 03, 2017

Filed:

Apr. 03, 2014

Chip card substrate and method of forming a chip card substrate

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Siegfried Hoffner, Nesselwang, DE;

Mohammed Reza Hussein, Regensburg, DE;

Frank Pueschner, Kelheim, DE;

Thomas Spoettl, Mintraching, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Viering, Jentschura & Partner mbB

Primary Examiner:

Hai Vo

Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 37/24 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 3/26 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); B32B 27/20 (2006.01); B32B 37/14 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 3/26 (2013.01); B32B 7/12 (2013.01); B32B 27/20 (2013.01); B32B 27/304 (2013.01); B32B 27/32 (2013.01); B32B 27/322 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 37/12 (2013.01); B32B 37/24 (2013.01); B32B 37/142 (2013.01); B32B 2037/243 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2264/105 (2013.01); B32B 2307/202 (2013.01); B32B 2329/04 (2013.01); B32B 2379/08 (2013.01); B32B 2425/00 (2013.01); Y10T 156/10 (2015.01); Y10T 428/24998 (2015.04);
Abstract

A chip card substrate is provided that includes a first polymer layer including a first polymer material. The chip card substrate further includes an intermediate layer disposed over the first polymer layer and including polyolefin including a plurality of micro pores, an adhesive layer disposed over the intermediate layer and including an adhesive, and a second polymer layer disposed over the adhesive layer and including a second polymer material different from the first polymer material.

Find Patent Forward Citations

Hoffner, Siegfried. (2017). Chip card substrate and method of forming a chip card substrate (U.S. Patent No. 9533473). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9533473

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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