The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Jun. 25, 2015
Applicant:

Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Yuuichi Mabuchi, Tokyo, JP;

Tetsuya Kawashima, Tokyo, JP;

Daisuke Matsumoto, Tokyo, JP;

Akira Mima, Tokyo, JP;

Yukio Hattori, Tokyo, JP;

Hiroshi Kamizuma, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20909 (2013.01); H05K 7/20936 (2013.01);
Abstract

A power conversion device capable of reducing a temperature variation between a plurality of semiconductor modules is provided. The power conversion device comprises condensers, a plurality of semiconductor modules, heat dissipation unitsto, a bus barconnecting the condenserswith the plurality of the semiconductor modules, and a ventilation unit having cool wind blow. The power conversion module has features that the plurality of semiconductor modulesare arranged apart from the condensersand in a line in a longitudinal direction of the bus barand that the cool windblows in a direction from the condenserstoward the plurality of semiconductor modulesthat are mounted.


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