The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2016
Filed:
Jun. 27, 2014
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Shunji Baba, Yokohama, JP;
Takashi Kanda, Kawasaki, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4694 (2013.01); H05K 1/0298 (2013.01); H05K 1/11 (2013.01); H05K 1/14 (2013.01); H05K 2201/0352 (2013.01); H05K 2203/061 (2013.01);
Abstract
A multilayer substrate includes a first substrate a second substrate that is stacked on and electrically connected to the first substrate, the second substrate having a different characteristic from a characteristic of the first substrate, a third substrate that is provided on a side of the first substrate, the second substrate being provided on the side of the first substrate, and the third substrate is electrically connected to the second substrate, and a connection member that electrically connects the first substrate and the third substrate to each other while the second substrate is bypassed.