The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Aug. 12, 2013
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Frank Winter, Regensburg, DE;

Ottmar Geitner, Pentling, DE;

Ivan Nikitin, Regensburg, DE;

Juergen Hoegerl, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 3/4608 (2013.01); Y10T 29/49002 (2015.01);
Abstract

According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mold compound and comprises surface structures.


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