The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Jan. 03, 2007
Applicants:

Christian Block, Stainz, AT;

Pavol Dudesek, Bad Gams, AT;

Thomas Feichtinger, Graz, AT;

Christian Hoffmann, Deutschlandsberg, AT;

Guenter Pudmich, Köflach, AT;

Inventors:

Christian Block, Stainz, AT;

Pavol Dudesek, Bad Gams, AT;

Thomas Feichtinger, Graz, AT;

Christian Hoffmann, Deutschlandsberg, AT;

Guenter Pudmich, Köflach, AT;

Assignee:

EPCOS AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 18/00 (2006.01); C04B 35/46 (2006.01); B32B 17/00 (2006.01); B32B 5/00 (2006.01); C03C 3/00 (2006.01); H05K 1/16 (2006.01); H01C 1/14 (2006.01); H01C 7/18 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/40 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01F 10/20 (2006.01); H01F 17/00 (2006.01); H01L 25/16 (2006.01); H03H 1/00 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H01F 10/26 (2006.01);
U.S. Cl.
CPC ...
H05K 1/162 (2013.01); B32B 18/00 (2013.01); H01C 1/14 (2013.01); H01C 7/18 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 4/40 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/552 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6565 (2013.01); C04B 2235/6567 (2013.01); C04B 2237/341 (2013.01); C04B 2237/343 (2013.01); C04B 2237/346 (2013.01); C04B 2237/348 (2013.01); C04B 2237/366 (2013.01); C04B 2237/564 (2013.01); C04B 2237/62 (2013.01); C04B 2237/68 (2013.01); C04B 2237/702 (2013.01); C04B 2237/704 (2013.01); H01F 10/20 (2013.01); H01F 10/265 (2013.01); H01F 17/0013 (2013.01); H01L 25/16 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/3011 (2013.01); H03H 2001/0085 (2013.01); H05K 1/0306 (2013.01); H05K 1/165 (2013.01); H05K 1/167 (2013.01); H05K 3/4611 (2013.01); H05K 3/4629 (2013.01); H05K 3/4688 (2013.01); Y10T 428/265 (2015.01);
Abstract

A film stack made from compacted green films and capable of being sintered to form a ceramic component with monolithic multi-layer structure is disclosed. The film stack includes a functional layer comprising a green film comprising a functional ceramic and a tension layer comprising a green film comprising a dielectric material. The tension layer is directly adjacent to the functional layer in the multi-layer structure. The multilayer structure also includes a first metallization plane and a second metallization plane. The functional layer is between the first metallization plane and the second metallization plane.


Find Patent Forward Citations

Loading…