The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2016
Filed:
Jun. 30, 2015
Murata Manufacturing Co., Ltd., Kyoto, JP;
Hiroyuki Ohata, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A multi-layer resin substrate is a multi-layer resin substrate integrated by stacking and thermocompression bonding a plurality of resin layers each composed of a thermoplastic resin as a main material and having a main surface. The plurality of resin layers include a resin layer having a pattern member arranged on the main surface. A surface of at least some resin layers of the plurality of resin layers has a paint layer, which is obtained by applying a thermoplastic resin paint to a region corresponding to a region insufficient in thickness as a stack as a whole during a process for stacking and thermocompression bonding the plurality of resin layers. The pattern member is provided, for example, by a conductor pattern.