The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2016
Filed:
Feb. 23, 2011
Hiroyuki Osuga, Chiyoda-ku, JP;
Sohei Samejima, Chiyoda-ku, JP;
Kazuhito Sakurada, Minami-alps, JP;
Akira Yagasaki, Minami-alps, JP;
Tatsuya Hinata, Minami-alps, JP;
Hiroyuki Osuga, Chiyoda-ku, JP;
Sohei Samejima, Chiyoda-ku, JP;
Kazuhito Sakurada, Minami-alps, JP;
Akira Yagasaki, Minami-alps, JP;
Tatsuya Hinata, Minami-alps, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
NIPPON AVIONICS CO., LTD., Tokyo, JP;
Abstract
On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes preparing a CFRP core, forming a through hole so as to penetrate the CFRP core from the front surface side to the back surface side and include a region in which the component is to be mounted when viewed in a plan view, and embedding a GFRP core having insulating properties within the through hole by filling the through hole with a resin having insulating properties and curing the resin. According to the manufacturing method, the component mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.