The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9530982 B1

Expired

Date of Patent:

Dec. 27, 2016

Filed:

Nov. 05, 2014

Packaging method and packaging structure of substrate

Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Yawei Liu, Guangdong, CN;

Chihche Liu, Guangdong, CN;

Assignee:

Shenzhen China Star Optoelectronics Technology Co., Ltd, Shenzhen, Guangdong, CN;

Attorney:

Andrew C. Cheng

Primary Examiner:

Nitin Parekh

Int. Cl.

CPC ...

H01L 21/00 (2006.01); H01L 51/52 (2006.01); H01L 33/48 (2010.01); H01L 33/52 (2010.01); G02F 1/1339 (2006.01); G02F 1/1368 (2006.01); H01L 27/32 (2006.01); H01L 51/56 (2006.01);

U.S. Cl.

CPC ...

H01L 51/5246 (2013.01); G02F 1/1339 (2013.01); G02F 1/1368 (2013.01); G02F 1/13394 (2013.01); H01L 27/3244 (2013.01); H01L 33/48 (2013.01); H01L 33/52 (2013.01); H01L 51/56 (2013.01); H01L 51/525 (2013.01); H01L 2227/323 (2013.01); H01L 2251/566 (2013.01);

Abstract

The present invention provides a packaging method of a substrate and a packaging structure. The method includes: (1) providing a substrate and a packaging cover plate; (2) coating a loop of first enclosing resin on the packaging cover plate; (3) coating a loop of second enclosing resin on an external circumferential area of the first enclosing resin on the packaging cover plate; (4) laminating the packaging cover plate and the substrate together; (5) applying ultraviolet (UV) light to irradiate the first enclosing resin and the second enclosing resin for curing; and (6) carrying out cutting operations on the substrate and the packaging cover plate to remove portions of the substrate and the packaging cover plate that contact the second enclosing resin so as to achieve packaging of the substrate with the packaging cover plate.

Find Patent Forward Citations

Liu, Yawei. (2016). Packaging method and packaging structure of substrate (U.S. Patent No. 9530982). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9530982

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile