The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9530976 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 27, 2016

Filed:

Nov. 17, 2015
Applicant:

Orthogonal, Inc., Rochester, NY (US);

Inventors:

Marc Ferro, Aix en Provence, FR;

George Malliaras, Fuveau, FR;

Assignee:

ORTHOGONAL, INC., Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/05 (2006.01); H01L 51/10 (2006.01); G01N 27/00 (2006.01); G03F 7/20 (2006.01); H01L 51/00 (2006.01); G03F 7/30 (2006.01); G03F 7/00 (2006.01); G03F 7/004 (2006.01); G03F 7/38 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0541 (2013.01); G01N 27/00 (2013.01); G03F 7/00 (2013.01); G03F 7/0046 (2013.01); G03F 7/2022 (2013.01); G03F 7/30 (2013.01); G03F 7/38 (2013.01); H01L 51/0018 (2013.01); H01L 51/102 (2013.01); H01L 51/105 (2013.01);
Abstract

A method of making a structure having a patterned a base layer and useful in the fabrication of optical and electronic devices including bioelectronic devices includes, in one embodiment, the steps of: a) providing a layer of a radiation-sensitive resin; b) exposing the layer of radiation-sensitive resin to patterned radiation to form a base layer precursor having a first pattern of exposed radiation-sensitive resin and a second pattern of unexposed radiation-sensitive resin; c) providing a layer of fluoropolymer in a third pattern over the base layer precursor to form a first intermediate structure; d) treating the first intermediate structure to form a second intermediate structure; and e) selectively removing either the first or second pattern of resin by contacting the second intermediate structure with a resin developing agent, thereby forming the patterned base layer. The method is capable of providing multilayer articles having almost any shape at high resolution without the need for expensive or damaging mechanical or laser cutting.


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